Datacon 2200 evo price
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Due to the high flexibility of the multi-chip die bonder, the adhesive tape feeder & cutter can also be integrated at the main axis for single-pass production of thin dies or wet-in-wet stack dies. An optionally available heated bond base and bond head will serve for good process results. This results in considerable throughput increase! Flip chip is still possible without the need to change any configuration. While the ID axis places the film on the substrate, the main axis bonds the die on the prior ready-made bond positions. To provide even more flexibility, an adhesive tape feeder & cutter can be integrated at the additional dispense axis, offering the parallel processing of film application and die placement in one module. For very high production volumes, several Multi-chip die bonders can be linked up to work in parallel. The tried-and-tested, modular concept has also been retained in the multi-chip die bonder. Equipped with integrated dispenser, 8 wafer handling, automatic tool changer, and application specific tooling, the Datacon 2200 evo is prepared for present and future processes and products.
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This significantly increases not only the throughput but also in particular the yield. The Datacon 2200 evo high-accuracy multi-chip die bonder provides the ultimate flexibility for die attach as well as for flip chip applications.
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This enables production, for instance of SiPs (System in a Package), with all kinds of active and passive components in a single pass. Further features include the heatable bonding tool, for example for stacked-die applications, and the broad handling range from 250 µm small up to 50 mm large dies. Of course the multi-chip die bonder is not just intended for die attach, but is also a fully-fledged flip-chip bonder.